The AWMF-0169 is a highly integrated silicon quad core IC intended for 5G phased array applications. The device supports four Tx/Rx radiating elements, includes all requisite beam steering controls for phase and gain control, and operates in half duplex fashion to enable a single antenna to support both Tx and Rx operation. Additional features include gain compensation over temperature, temperature reporting, Tx power telemetry, and fast beam switching using on-chip beam weight storage registers. The device features ESD protection on all pins, operates from +1.8 V and +2.5 V supplies, and is packaged WLCSP (wafer level chip scale package) for easy flip chip installation in planar phased array antennas.
The Gen-2 5G ICs were the first 3GPP compliant commercially available ICs for 5G.
3GPP Compliant 5G communications arrays in the n260 band
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