We have extensive design experience in accurate model development of chip packages like QFN, ceramic, etc. used to integrate active/passive circuits. We can develop simple and efficient models that take into account the distributed ground coupling so that effect of common mode on the chip performance can be included. Coupled ground bond models can then be integrated in a unique way using transformers to achieve reliable chip-in-package performance. We have extensively used these models to predict the anomalies of common mode and the isolation differences observed by the chip manufacturers due to packaging.

• Accurate parasitics extraction
• HFSS simulated as needed
• Ground coupling modeling
• Bondwire interaction
• Common mode inductance inclusion

Typical Methodology of Package Modeling